Thermal Management for Opto-electronics Packaging and Applications
Juli 2024
368 Seiten, Hardcover
Wiley & Sons Ltd
A systematic guide to the theory, applications, and design of thermal management for LED packaging
In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.
The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.
The book also includes:
* A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
* Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
* Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
* Complete treatments of hybrid thermal management in downhole devices
Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.
Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).
