Vibration Analysis for Electronic Equipment
3. Auflage Juli 2000
XXIV, 416 Seiten, Hardcover
Wiley & Sons Ltd
ISBN:
978-0-471-37685-9
John Wiley & Sons
Kurzbeschreibung
Anhand zahlreicher praxisnaher Beispiele erläutert der Autor - ein Experte mit langjähriger Erfahrung - verschiedene Schwingungstypen der Umgebung, die zum Versagen elektronischer Systeme oder Bauteile führen können. Die sorgfältig aktualisierte Neuauflage stellt Ihnen analytische Methoden zum Entwurf, Test und Betrieb komplizierter Systeme mit hohen Anforderungen an die Zuverlässigkeit zur Verfügung. (08/00)
Vibrations of Simple Electronic Systems.
Component Lead Wire and Solder Joint Vibration Fatigue Life.
Beam Structures for Electronic Subassemblies.
Component Lead Wires as Bents, Frames, and Arcs.
Printed Circuit Boards and Flat Plates.
Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life.
Preventing Sinusoidal Vibration Failures in Electronic Equipment.
Designing Electronics for Random Vibration.
Acoustic Noise Effects on Electronics.
Designing Electronics for Shock Environments.
Design and Analysis of Electronic Boxes.
Effects of Manufacturing Methods on the Reliability of Electronics.
Vibration Fixtures and Vibration Testing.
Environmental Stress Screening for Electronic Equipment (ESSEE).
Bibliography.
Index.
Component Lead Wire and Solder Joint Vibration Fatigue Life.
Beam Structures for Electronic Subassemblies.
Component Lead Wires as Bents, Frames, and Arcs.
Printed Circuit Boards and Flat Plates.
Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life.
Preventing Sinusoidal Vibration Failures in Electronic Equipment.
Designing Electronics for Random Vibration.
Acoustic Noise Effects on Electronics.
Designing Electronics for Shock Environments.
Design and Analysis of Electronic Boxes.
Effects of Manufacturing Methods on the Reliability of Electronics.
Vibration Fixtures and Vibration Testing.
Environmental Stress Screening for Electronic Equipment (ESSEE).
Bibliography.
Index.
