Vibration Analysis for Electronic Equipment
3. Edition July 2000
XXIV, 416 Pages, Hardcover
Wiley & Sons Ltd
ISBN:
978-0-471-37685-9
John Wiley & Sons
Short Description
This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Vibrations of Simple Electronic Systems.
Component Lead Wire and Solder Joint Vibration Fatigue Life.
Beam Structures for Electronic Subassemblies.
Component Lead Wires as Bents, Frames, and Arcs.
Printed Circuit Boards and Flat Plates.
Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life.
Preventing Sinusoidal Vibration Failures in Electronic Equipment.
Designing Electronics for Random Vibration.
Acoustic Noise Effects on Electronics.
Designing Electronics for Shock Environments.
Design and Analysis of Electronic Boxes.
Effects of Manufacturing Methods on the Reliability of Electronics.
Vibration Fixtures and Vibration Testing.
Environmental Stress Screening for Electronic Equipment (ESSEE).
Bibliography.
Index.
Component Lead Wire and Solder Joint Vibration Fatigue Life.
Beam Structures for Electronic Subassemblies.
Component Lead Wires as Bents, Frames, and Arcs.
Printed Circuit Boards and Flat Plates.
Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life.
Preventing Sinusoidal Vibration Failures in Electronic Equipment.
Designing Electronics for Random Vibration.
Acoustic Noise Effects on Electronics.
Designing Electronics for Shock Environments.
Design and Analysis of Electronic Boxes.
Effects of Manufacturing Methods on the Reliability of Electronics.
Vibration Fixtures and Vibration Testing.
Environmental Stress Screening for Electronic Equipment (ESSEE).
Bibliography.
Index.
